As an ISO9001 certificated PCB Assembly factory, STHL Electronics adheres to a thorough quality and process control. The tests and inspections include physical and visual inspections, open & short tests, AOI inspections, X-ray inspection, and In-Circuit tests. These PCBA inspection process ensure customers final product meets their design specifications, and also control the whole production lot to high non-defective ratio which reduce the entire lead time.
Inspection & Testing Equipment |
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| Name | AOI inspection | X-Ray inspection | Aging testing | Function testing |
| Part number | JTA-320-M | AX7200 | / | / |
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| Specification | JTA-320-M | Magnification: 250X Resolution ratio: 75/110Lp/cm Focus size: 5μm | design as per projects | design as per projects |
| Quantity | 4 | 1 | as per order qty and requests | as per order qty and requests |
| Test Purpose | 100% inspection for every board; To check if any components missing, damage, deviation or opposite assemble. | Inspection BGAs assembling if any fake assemble or shortcuts. Ensure all BAG balls assembled perfectly. | We can make 4 hours-12 hours aging testing to make sure all boards working status. Before shipment. | Simple function test for boards. Can test radio, video, display, warning function… |
1, Checks for solder paste conditions
2, Checks for components down to 0201 package
3, Checks for missing components, offset, incorrect parts, polarity, warp, bent pins…
1, Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2, Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3, Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4, SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5, Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6, Inner rupture or hollow inspection in plastic or metal.
7, Battery stacking uniformity, electrode welding inspection.
8, Seed, biological material inspection etc.
