Assembly components footprint
1. 0201, 0402, 0603, 0805…
2. BGA, QFN, QFP, MLF
3. DIP, SDIP, TSSOP, PLCC
4. QSOP, SSOP, QFN, MLP
5. SOIC, POP, SOP, MSOP
Mainly components package
1. Reels Package
2. Cut Tape Package
3. Tube Package
4. Tray Package
5. Loose parts and bulk
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